MYIR Entertains with 6 Arm Cortex-A55 Cores on 1 Module

By Chad Cox

Production Editor

Embedded Computing Design

August 29, 2023

News

Image Credit: MYIR

Shenzhen, China. MYIR released its 82mm by 45mm MYC-JD9360 CPU module built around the D9-Pro (D9360) from SemiDrive. The module comes with six Arm Cortex-A55 cores (up to 1.6GHz) and one dual-core Cortex R5 core (800MHz). The delivered integrations are 2GB LPDDR4, 16GB eMMC, 16MB QSPI Flash, 256Kbit EEPROM, Watchdog timer chip, and Isolated power supply (5V/5A).

MYIR’s MYC-JD9360 leverages the D9-Pro processor adding the capability of 3D graphics processing, high-efficiency AI accelerator, and high-definition visual processing. It runs multiple OS such as Linux, Ubuntu, and Android OS, as well as supporting the following software resources: bootloader, kernel, drivers, images, and relative development tools. The solution offers a wide range of operating temperatures from -40 Celsius to 85 Celsius.

A comprehensive list of IO signals on a 1.0mm pitch 314-pin Gold-finger-edge-card Connector is included below. The number next to the signals signifies the maximum amount supported.  

  • 2 x Gigabit Ethernet
  • 2 x PCIe3.0
  • 2 x USB3.0 (DRD)
  • 2 x SDIO
  • 11 x UART (supports up to 16 x UART)
  • 2 x CAN-FD (supports up to 4 x CAN-FD)
  • 4 x I2C (supports up to 12 x I2C)
  • 2 x SPI (supports up to 8 x SPI)
  • 4 x 12bit ADC
  • 1 x MIPI CSI
  • 2 x LVDS
  • 1 x Parallel CSI
  • 1 x MIPI CSI
  • 4 x Single-channel I2S/TDM
  • 2 x Multi-channel I2S
  • 1 x JTAG
  • Up to 135 x GPIOs

Ideal applications for the MYC-JD9360 CPU module are industrial robots, engineering machinery T-BOX, intelligent cockpits, in-vehicle entertainment, and intelligent medical equipment.

For more information, visit myirtech.com.

Chad Cox is the Production Editor at Embedded Computing Design. His responsibilities are centered around content creation, writing and editing, and article research and development. Chad covers industry news and events and is known to interact with various industrial leaders via on-premise visits and online interviews. He is responsible for the digital footprint and dissemination of news via social media posts, advertising creation and the production of newsletters including the Embedded Computing Design’s Daily.

He is well versed in many facets of industrial computing including Edge AI, IoT, Processing, Security, Open Source, and more.

Chad graduated from the University of Cincinnati with a B.A. in Cultural and Analytical Literature and holds a master’s in education.

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