Flex Power Modules Upgrades BMR510 with Higher Current Capacity and Simplified VRM Design
January 22, 2025
News
Flex Power Modules enhanced its compact BMR510 2-phase integrated power stage module with improved efficiency and increases peak current from 140 A to 160 A. The solution integrates 528 µF of onboard capacitance improving transient response while reducing external component requirements and simplifying design.
Developed for enhanced AI applications, the module delivers 80 A continuous current with an adjustable voltage range of 0.5 to 1.8 V, offering the power needs of advanced CPUs, GPUs, IPUs, FPGAs, and ASICs.
The utilization of top-side cooling combined with upper-side power stages ensures thermal management and consistent performance in harsh environments. Designed for a 4.5 to 15 V input range, the module features a 0.9 cm² (0.14 in²) footprint.
The halogen-free module supports LGA or solder bump terminations for adaptable integration. It incorporates essential protections such as over-current and over-temperature safeguards, and features tri-state PWM inputs.
For more information, visit flexpowermodules.com.
Chad Cox is the Production Editor at Embedded Computing Design. His responsibilities are centered around content creation, writing and editing, and article research and development. Chad covers industry news and events and is known to interact with various industrial leaders via on-premise visits and online interviews. He is responsible for the digital footprint and dissemination of news via social media posts, advertising creation and the production of newsletters including the Embedded Computing Design’s Daily.
He is well versed in many facets of industrial computing including Edge AI, IoT, Processing, Security, Open Source, and more.
Chad graduated from the University of Cincinnati with a B.A. in Cultural and Analytical Literature and holds a master’s in education.
