Munich-based Data Modul AG‘s conga-MA3, based on the latest Intel Atom processor E3800 family, has now reached mass production from their esteemed partner congatec. The COM Express Mini Type 10 conga-MA3′s compact profile enables high performance, yet low TDP to be injected into the smallest of embedded packages. Most intriguingly is the inclusion of ceramic capacitors, optimizing an already impressive product lifespan.

Today’s I/O technology is supported in abundance, integrating PCIe and USB 3.0. Clearly targeted at graphical applications, the available TMDS compliant outputs (DVI & HDMI) alongside DisplayPort boast massive output resolutions and with the latest Intel integrated graphics, at high frame rates and supporting dual independent displays.

Look for daily updates about what you can expect to see at Embedded World as we get closer to the show on February 24-26.