SiFive Partners with QuickLogic for Rapid Chip Design SoC Templates

By Rich Nass

Contributing Editor

Embedded Computing Design

May 01, 2019

News

SiFive Partners with QuickLogic for Rapid Chip Design SoC Templates

SiFive, a provider of RISC-V core IP, recently announced its Freedom Aware (FA) family of SoC templates as well as a strategic development partnership with QuickLogic.

SiFive, a provider of RISC-V core IP, recently announced its Freedom Aware (FA) family of SoC templates as well as a strategic development partnership with QuickLogic. The FA SoC templates, which focus on intelligent processors targeting Edge and end-point applications, potentially lowers the cost and development time associated with new SoC designs.

SoC templates can reduce design time by using tested building blocks and a suite of development tools to ensure that finished SoCs mirror the results of pre-fabrication software emulations. The Freedom Aware SoC Templates leverage SiFive’s heterogeneous multi-core architecture and QuickLogic’s AI subsystem that’s available with programmable acceleration and sophisticated power-management technology that delivers ultra-low power solutions optimized for battery-powered consumer and industrial IoT applications.

In its implementation, two SiFive RISV-V cores (control plane and data plane) are embedded within the SiFive templates with Quicklogic’s eFPGA. Specifically, SiFive’s data-plane processor is coupled with the QuickLogic eFPGA to assist with algorithm acceleration and further customization.

The FA SoC Templates include an MCU that’s optimized for industrial and commercial IoT devices, with multiple processors, security cores, hardware accelerators, and always-on sensing. Other features include bundled predictive maintenance (PdM 4.0), and an always-on voice processor.

Rich Nass is a regular contributor to Embedded Computing Design. He has appeared on more than 500 episodes of the popular Embedded Executive podcast series, and is a regular contributor to the Embedded Insiders podcast.

Rich has been in the engineering OEM industry for more than 35 years, and is a recognized expert in the areas of embedded computing, Edge AI, industrial computing, the IoT, and cyber-resiliency and safety and security issues. He writes and speaks regularly on these topics and more.

Rich is currently the Liaison to Industry for the Embedded World North America Exhibition and Conference, and has held similar positions with the global Embedded World Conference and Exhibition.

Previously, Rich was the Brand Director for UBM’s award-winning Design News property. Prior to that, he led the content team for UBM Canon’s Medical Devices Group, as well all custom properties and events.  In prior stints, he led the Content Team at EE Times, handling the Embedded and Custom groups and the TechOnline DesignLine network of design engineering web sites.

Nass holds a BSEE degree from the New Jersey Institute of Technology.

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