Renesas' RZ/G2 64-Bit MPUs Combine High-Performance with Long-Term Linux Support

By Rich Nass

Contributing Editor

Embedded Computing Design

March 08, 2019

News

Renesas' RZ/G2 64-Bit MPUs Combine High-Performance with Long-Term Linux Support

The Renesas RZ MCU platform has grown to the RZ/G2 group of 64-bit Arm Cortex-A57 and Cortex-A53-based microprocessors.

The mighty just got mightier. By that I mean that Renesas RZ MCU platform, which was already quite formidable, has grown to the RZ/G2 group of 64-bit Arm Cortex-A57 and Cortex-A53-based microprocessors (the video below explains the feature set). Aimed at industrial and building automation applications, the four new RZ/G2 MPUs are supported by the company’s RZ/G Linux Platform.

The RZ/G2 MPUs feature a combination of high-performance 64-bit MPUs, a comprehensive set of integrated interfaces, error checking and correction (ECC) protection on both internal and external memories, and a full Verified Linux Package (VLP) featuring a Civil Infrastructure Platform (CIP) Super Long-Term Support (SLTS) Linux kernel, bundled with a software development environment that binds safety, security, and reliability across the software and hardware. Renesas also claims that the RZ/G2 MPUs are the first embedded processors to offer more than 10 years of support for the 64-bit Linux kernel.

Included is support for the latest high-speed protocols for external memories including LPDDR4 or DDR3L up to 3200 MT/s. There’s an on-chip 3D graphics engine, H.264 and H.265 codec with 4K support, and HDMI, LVDS, and MIPI-CSI2 camera input interfaces.

The four devices include the eight-core RZ/G2H, the six-core RZ/G2M, and the two-core RZ/G2N and RZ/G2E. Sample shipments of the six-core RZ/G2M and two-core RZ/G2E are available now; the other MPU models will be released over time. Mass production is scheduled to commence in early 2020.

Rich Nass is a regular contributor to Embedded Computing Design. He has appeared on more than 500 episodes of the popular Embedded Executive podcast series, and is a regular contributor to the Embedded Insiders podcast.

Rich has been in the engineering OEM industry for more than 35 years, and is a recognized expert in the areas of embedded computing, Edge AI, industrial computing, the IoT, and cyber-resiliency and safety and security issues. He writes and speaks regularly on these topics and more.

Rich is currently the Liaison to Industry for the Embedded World North America Exhibition and Conference, and has held similar positions with the global Embedded World Conference and Exhibition.

Previously, Rich was the Brand Director for UBM’s award-winning Design News property. Prior to that, he led the content team for UBM Canon’s Medical Devices Group, as well all custom properties and events.  In prior stints, he led the Content Team at EE Times, handling the Embedded and Custom groups and the TechOnline DesignLine network of design engineering web sites.

Nass holds a BSEE degree from the New Jersey Institute of Technology.

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