UWB antennas enable centimeter-level indoor positioning

By Rich Nass

Contributing Editor

Embedded Computing Design

September 06, 2017

UWB antennas enable centimeter-level indoor positioning

Taoglas has launched a family of small-form-factor ultra-wideband (UWB) antennas designed to enable centimeter-level positioning and angle-of-arrival applications.

Taoglas, a provider of IoT and M2M antenna products, recently launched a family of small-form-factor ultra-wideband (UWB) antennas designed to enable centimeter-level positioning and angle-of-arrival applications. This includes asset tracking, follow-me drones, healthcare monitoring, smart home services, and other applications that demand high-performance indoor localization capabilities. The antennas offer high efficiencies across a wide spectrum of frequency bands from 3 to 10 GHz.

Indoor wireless positioning has long been hampered by technologies that were not designed for this purpose, such as Bluetooth, Wi-Fi, and assisted GPS. UWB is a low-power digital wireless technology that increases location precision and range while transmitting large amounts of data short distances over a wide spectrum of frequency bands. UWB’s low-power requirements offer increased battery life of sensors and tags, leading to reduction in overall operational costs.

Taoglas’ range of UWB antennas features both flexible and rigid PCB embedded units, as well as UWB embedded SMT chip antennas. The flexible FXUWB antennas were developed using a simple “peel and stick” assembly process, attaching securely to non-metal surfaces with a flexible micro-coaxial cable mounting. The chip antennas are designed to be surface mounted directly onto a PCB. The UWB antennas can be used with the DecaWave DW1000 chip, and are also compatible with other UWB sensor modules.

Rich Nass is a regular contributor to Embedded Computing Design. He has appeared on more than 500 episodes of the popular Embedded Executive podcast series, and is a regular contributor to the Embedded Insiders podcast.

Rich has been in the engineering OEM industry for more than 35 years, and is a recognized expert in the areas of embedded computing, Edge AI, industrial computing, the IoT, and cyber-resiliency and safety and security issues. He writes and speaks regularly on these topics and more.

Rich is currently the Liaison to Industry for the Embedded World North America Exhibition and Conference, and has held similar positions with the global Embedded World Conference and Exhibition.

Previously, Rich was the Brand Director for UBM’s award-winning Design News property. Prior to that, he led the content team for UBM Canon’s Medical Devices Group, as well all custom properties and events.  In prior stints, he led the Content Team at EE Times, handling the Embedded and Custom groups and the TechOnline DesignLine network of design engineering web sites.

Nass holds a BSEE degree from the New Jersey Institute of Technology.

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