Renesas is in the Driver Seat with New Intelligent Power Devices for Automotive
January 18, 2023
News
Tokyo, Japan. Renesas Electronics Corporation made available an automotive Intelligent Power Device (IPD), RAJ2810024H12HPD, for safe and flexible management of power dissemination in vehicles. The solution delivers the needs of next-generation E/E (electrical/electronic) architectures. It was designed in a TO-252-7 form factor which helps reduce the mounting vicinity by 40% when compared to the conventional TO-263.
The RAJ2810024H12HPD detects abnormalities in current at low loads enabling developers to create safe and exact power control systems with even the smallest anomalies detected. "We are very pleased to launch a new generation of automotive IPDs featuring our new power MOSFET process,” said Akira Omichi, Vice President of Renesas' Automotive Analog Application Specific Business Division. “Renesas will continue to develop IPDs that improve the safety and reliability of power supply systems and facilitate system development for our customers by offering system-level solutions with our microcontrollers.”
Renesas Integrated the following into its RAJ2810024H12HPD:
- Single-channel high-side IPD
- Small TO-252-7 package (6.10 x 6.50 mm: excluding pins)
- Low on-resistance (Ron) of 2.3mΩ at 25°C (typ.)
- Highly accurate current detection at low loads
- Built-in charge pump
- Self-diagnostic feedback by load current sense
- Protection functions such as load short-circuit, overheat detection, sense current output, and GND open protection
- Supports 3.3V/5V logic interface
- Low standby current
- Battery reverse connection protection with self-turn-on
- Compliant with AEC-Q100 and RoHS automotive standards
More information is available at renesas.com/win.
Chad Cox is the Production Editor at Embedded Computing Design. His responsibilities are centered around content creation, writing and editing, and article research and development. Chad covers industry news and events and is known to interact with various industrial leaders via on-premise visits and online interviews. He is responsible for the digital footprint and dissemination of news via social media posts, advertising creation and the production of newsletters including the Embedded Computing Design’s Daily.
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Chad graduated from the University of Cincinnati with a B.A. in Cultural and Analytical Literature and holds a master’s in education.
