X-FAB Silicon Foundries SE
Attopsemi's I-fuse OTP Memories Now Available on X-FAB’s 180 nm Technology - News
May 12, 2022X-FAB Silicon Foundries, together with Attopsemi, revealed that the newest version of Attopsemi‘s I-fuse IP with its next generation architecture has been effectively demonstrated on X-FAB’s XH018 180 nm process technology.
X-FAB's Automotive 180nm BCD-on-SOI Technology Platform for Smart Actuators and Power Management - News
February 24, 2020X-FAB?s XT018 technology is also one that offers a full range of automotive grade-0 qualified memory options, including SONOS-based Flash and embedded EEPROM.
X-FAB Adds Non-Volatile Memory Functions to its 180nm BCD-on-SOI Platform - News
November 05, 2019Robust Flash and EEPROM, based on company's proven SONOS technology, enable a wealth of new possibilities in automotive, medical and industrial sectors.
X-FAB Strengthens its Foundry Service Cooperation with EUROPRACTICE - Press Release
October 23, 2019X-FAB Silicon Foundries SE, the leading analog/mixed-signal and specialty foundry has announced that it is broadening the scope of its cooperation with the EUROPRACTICE Consortium.
X-FAB Strengthens its Foundry Service Cooperation with EUROPRACTICE - Press Release
October 09, 2019X-FAB Silicon Foundries SE has announced that it is broadening the scope of its cooperation with the EUROPRACTICE Consortium.
X-FAB Expands its 180nm BCD-on-SOI Technology Platform with New High-Voltage Devices Designed for Next Generation Automotive Applications - Press Release
August 26, 2019X-FAB Silicon Foundries SE announced the availability of new high-voltage primitive devices targeted at the growing market for automotive 48V board net and battery management system (BMS) ICs.
X-FAB Introduces Highly-Sensitive SPAD and APD Devices Based on its Modular 180nm Process Technology - Press Release
June 28, 2019X-FAB Silicon Foundries, the leading analog/mixed-signal and specialty foundry, continues to develop ground-breaking semiconductor solutions to address the most difficult of design challenges.