Renesas Electronics Corporation's SmartBond™ DA1470x Family is the only solution in the Bluetooth LE space to integrate a power management unit, a hardware voice activity detector (VAD), a Graphics Processing Unit (GPU), and Bluetooth LE connectivity into a single chip. This combined functionality provides smart IoT devices with advanced sensor and graphical capabilities and ultra-low-power, always-on audio processing.

Renesas Electronics announced two new cloud development kits, CK-RA6M5 and CK-RX65N, providing a complete connectivity solution for the RA and RX Families of 32-bit microcontrollers (MCUs).

Real-Time Innovations (RTI) announced its collaboration with Renesas on the RTI Connext Drive, the ISO-26262-certified communications framework for autonomous and electric vehicles running on Renesas System-on-Chips (SoC).

Renesas Electronics introduced an AUTOSAR-compliant complex device driver (CDD) software module for designers of automotive battery management systems (BMS) in electric vehicles (EVs).

Microcontroller Leader to Showcase Performance, High Integration and Security Advances at Embedded World 2022 Exhibition and Conference

Renesas Electronics announced that the security engine of its RA Family of 32-bit Arm Cortex-M microcontrollers (MCUs) has been certified by the National Institute of Standards and Technology (NIST) Cryptographic Algorithm Verification Program (CAVP). The drivers to utilize the certified SCE9 Protected Mode are included in the RA Family Flexible Software Package (FSP) v3.6.0 and later.

Renesas announced that it will conduct a 90-billion-yen worth investment in its Kofu Factory, located in Kai City, Yamanashi Prefecture, Japan. While the Factory was closed in October 2014, Renesas intends to reopen the fab in 2024 as a 300-mm wafer fab capable of manufacturing power semiconductors.