During India's Automation Expo 2023 DFI will be showcasing its factory automation solutions including SR-IOV virtualization technology and AGV/AMR robotics. At the expo, DFI will focus on the four areas - factory automation, rugged products, motherboards, and systems. Within DFI’s main themes will be embedded system modules and touchscreen tablets.

This week on Dev Kit Weekly, we’re going to be reviewing and raffling the AMD Ryzen Embedded 2000 Series-based PCSF51 1.8” Pi SBC from DFI.

Taipei, Taiwan. DFI is participating in Computex 2023. With Smart Cities being the spotlight this year, DFI and partner 5GIoTLead Technology is showcasing the 5G Smart Pole solution.

DFI, with assistance from VicOne, has moved into the electric vehicle (EV) market to develop innovations for secure vehicle software applications. The utilization of the solutions will add further network security to maintain smart cities. VicOne’s vehicle network security environment employs anywhere control of irregular data transmissions, including real-time alerts while supplying car manufacturers, fleet operators, and system suppliers a reliable way to defend against unwanted visitors.

DFI, the global provider of industrial computers, has introduced its ECX700-AL ruggedized x86 PC for outdoor edge computing applications. Its impeccable performance capabilities, compact size, and high durability make it the ideal solution for outdoor operations. The ECX700-AL is a rugged computer with a waterproof and dust-proof design to withstand harsh environments and any type of climate. Stable performance is ensured with its wide operating temperature of -40 to 70 degrees Celsius. It is also equipped with a smart vent that drains water automatically, preventing typical problems such as condensation within the system or excessive heat.

DFI, a global leader in embedded motherboards and industrial computers, today announced that they will be participating in Embedded World 2023 and joining Qualcomm Technologies, Inc. to showcase the world’s first SBC equipped with the high-performance Qualcomm® QRB5165 processor. With high integration capability and anti-vibration features, the product can be applied in fields such as industrial automation and AMR. It is expected to increase the overall AI edge computing efficiency and bring more capabilities to the industry.

DFI’s PCSF51 is the next-generation 1.8” single board computer that boosts performance to a new level .Featuring AMD Ryzen™ Embedded R2000 Series SoCs, this extremely compact credit card size SBC comes in an 84mm x 55 mm form factor with optimized power and sharp graphics. The all-new AMD Ryzen™ R2000 doubles the max CPU core count, providing up to 4U/8T, 8x GPU CU computing power.PCSF51 offers a wide range of scalability through various expansion slots, including SATA 3.0, USB 3.1, and M.2 expansion. It also supports up to 16 PCIe Gen3 connectivity to accommodate a broad range of I/O requirements