AIB-SO21/31 or AIB-SN31/41 is a small-sized embedded computer that supports the latest NVIDIA Jetson system-on-modules (two model names, one same carrier board that supports either an Orin Nano or an Orin NX: AIB-SO21/31 is built with an Orin Nano SoM; AIB-SN31/41 is built with an Orin NX SoM). The carrier board features two 4-Lane MIPI CSI-2, 22 pin FPC Connector, one RJ-45 GbE port, two USB 3.2 Gen2 Type A ports, one USB Type-C port, one M.2 M-Key, and one M.2 E-Key. 

Aetina's AI-MXM-H84A MXM module features four Hailo-8™ AI processors, providing up to 104 TOPS of AI performance with power consumption of 25W. The 3.1 Type B MXM module supports TensorFlow and ONNX, able to function well with the operating temperature from 0°C to +70°C. 

In literature when one crosses a body of water, it tends to symbolize a creation or a rebirth. Today on our Road to embedded world ’23 we are crossing a few bodies of water and making our way to the Xizhi District, New Taipei City, Taiwan. Here we are taking a tour of Aetina and learning more about its latest creations hitting the conference floor.

CES 2023. Aetina showed up to CES 2023 and unveiled its DeviceEdge, a NVIDIA Jetson-based series of embedded platforms, driven by NVIDIA Jetson Orin NX and Orin Nano system-on-modules (SoMs). The  Aetina series consists of the AIB-SO21/31 & AIB-SN31/41, AIB-MO22/32 & AIB-MN32/42, AIE-KO21/31 & AIE-KN31/41, and AIE-KO22/32 & AIE-KN32/42.

The latest buzzword term in our industry, end-to-end management, has a lot to do with following the flow of a project from beginning to end. There’s been software available for decades to manage that process, but for the most part, it relies completely on the humans to do the work. The software simply tracks the progress and allows lots of different groups and individuals in global and remote locations to interact with the project.

Embedded systems are often deployed in challenging environments, such as a smart factory, smart city, or smart transportation. And now, in addition to being able to withstand those harsh environments, many of the applications they support now require high-accuracy, server-class AI inferencing on data collected in the field.

Fibocom announced a collaboration with Aetina Corporation during Embedded World 2022. The joint effort aims to bring high-speed, ultra-reliable and low-latency 5G capacities, enabled by Fibocom’s 5G R16-compliant module FM160-EAU, to Aetina’s AN810-XNX AI edge computing platform, empowering robotics, UAV, industrial IoT, smart healthcare and more.