Winbond Electronics
Winbond Unveils 1Gb QspiNAND for Wearable and Low-Power IoT Devices - News
August 20, 2024Taichung, Taiwan – Winbond Electronics Corporation unveiled the W25N01KW, a 1Gb 1.8V QspiNAND flash solution designed to meet the demands of wearable and battery-operated IoT devices with low standby power, small-form-factor package, and continuous read for fast boot and instant-on support.
The Storage Technology Revolution in IoT - Blog
February 22, 2023In a recent IoT Analytics Research report, the IoT semiconductor market is set to grow from $33 billion (in 2020) to $80 billion by 2025, with the four fastest growing fields being IoT microcontrollers (MCUs), IoT connectivity chipsets, IoT AI chipsets, and IoT security chipsets and modules to achieve better performance and lower power in applications such as smart watches, automotive, and smart homes.
What You Missed at electronica 2022 - Blog
December 06, 2022Another trade show is in the books, and I’m pleased to report things are about as back to normal as they are likely to get. The show I’m referring to is electronica, which is held bi-annually in Munich, Germany. As such, it’s been four years since we’ve convened at what it is generally considered the world’s largest event for the embedded and electronics industries.
Choosing the Right Flash Memory for AI Endpoint Applications - Story
June 27, 2022Everyone will agree how important high-quality, high-reliability, and low-latency Flash Memory is for AI chips and applications. Finding the right balance of performance, power consumption, security, reliability, high efficiency for different applications is crucial. Cost, although important, should not be the most important consideration.
Winbond Proceeds with More DDR3 SDRAM Production - News
April 25, 2022Winbond Electronics Corporation announced significant enhancements to its DDR3 product on the ultra-high-speed performance.
Winbond & Infineon Technologies Collaborate to Double Bandwidth for IoT Applications with HYPERRAM 3.0 - News
April 19, 2022Winbond Electronics Corporation, together with Infineon Technologies, has announced the expansion of their HYPERRAM product collaboration with the new higher bandwidth HYPERRAM 3.0.
Embedded Executive: Johnson Chen, Executive, Winbond - News
September 08, 2021The global chip shortage continues to rage on, and it appears to be worsening rather than getting better.