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Siemens and UMC Develop 3D Integrated Circuit Hybrid-Bonding Workflow - News

October 11, 2022
Tiera Oliver Siemens   United Microelectronics (UMC)  

Siemens Digital Industries Software and United Microelectronics (UMC) are collaborating to develop and execute a new multi-chip 3D integrated circuit (IC) planning, assembly validation, and parasitic extraction (PEX) workflow for UMC’s wafer-on-wafer and chip-on-wafer technologies.