Siemens

Articles related to Siemens
Uncategorized

On-Demand Webcast: Empower sustainable aviation with digital twins - Podcast

November 09, 2022

To reach net-zero emissions by 2050, the aviation sector must rapidly accomplish its complete technology transformation.

AI & Machine Learning

An AI on Embedded Safety & Security Vulnerabilities - Podcast

October 28, 2022

On this episode of Embedded Insiders, we’re joined by Paul Butcher, Senior Software Engineer at AdaCore, to discuss how AI can make fuzz testing even more robust through the integration of techniques like symbolic execution and input-to-state correspondence that optimize test data sets against scenarios a system might encounter in the real world

Software & OS

Industrial Metaverse Blueprints, Part 2: The Metaverse Runs on Digital Twins - Story

October 27, 2022

The second article in our metaverse series focuses on defining the industrial metaverse, its building blocks, parallels with model-based systems engineering (MBSE), and examples of how modeling and simulation are being used to empower digital twin ecosystems.

Uncategorized

On-Demand AMA – Ask Siemens Anything: Digital twins for sustainable aviation and hydrogen-powered aircraft - Video

October 27, 2022

Globally, aviation accounts for 4.9% of the CO2 and non-CO2 emissions. Industry is taking steps to reduce aircraft emissions and improve fuel efficiency in an effort to combat climate change but with twice as many air travelers expected by 2037, those efforts alone will not be enough.

Software & OS

Reimagining Aircraft Configurations for the New Age of Hydrogen-Powered Flight - Whitepaper

October 24, 2022

How Hydrogen-Powered Jet Engines Are Fueling Sustainable Aircraft Design Innovation

Processing

Siemens and UMC Develop 3D Integrated Circuit Hybrid-Bonding Workflow - News

October 11, 2022

Siemens Digital Industries Software and United Microelectronics (UMC) are collaborating to develop and execute a new multi-chip 3D integrated circuit (IC) planning, assembly validation, and parasitic extraction (PEX) workflow for UMC’s wafer-on-wafer and chip-on-wafer technologies.