The latest requirements are constantly challenging test engineers with new tasks

The increased use of highly integrated electronic circuits is presenting new challenges for test engineers in manufacturing. Miniaturization often limits the number of applicable test methodologies. Test systems proven over several decades, such as in-circuit test (ICT) or flying-probe test, are reaching their limits because it is no longer possible to contact all the points needed for good coverage.

The rapid development of the electronics industry has produced a multitude of innovations that have a significant impact on our daily lives. From powerful smartphones to smart home appliances and autonomous vehicles. Electronic devices have fundamentally changed the way we communicate, work, and live. But behind every groundbreaking product is a complex process of product development and production.

Optimizing a complete wave soldering system, including assembly workstations and inline automatic optical inspection (AOI) from the ground up, implementing a smart factory implementation, and increasing the quality of the products, can be quite the challenge for system builders and testing specialists. However, this feat was accomplished by Pacha Automation and GÖPEL electronic.

From 21-23 June 2022, we will be presenting our Embedded JTAG Solutions as well as Automotive Test Solutions at embedded world 2022. Visit us at booth 4-432 at the Messe Nuremberg as we showcase our exceptional electronics test technologies: