Why UCIe Is an Integral Interconnect for Multi-Die Systems - Blog
November 08, 2022As multi-die systems grow more prevalent in the semiconductor space, the Universal Chiplet Interconnect Express (UCIe) specification is taking center stage.
How the Rise of Data Center Disaggregation Creates Demand for Co-Packaged Optics - Blog
May 24, 2022From online transactions to streaming videos and big data analytics, data centers are proving to be the workhorses of our smart, connected world. Higher volumes of data coupled with increasingly complex data are causing a shift in data center architectures. A new trend has emerged in data center architectures to address these two underlying forces: data center disaggregation.