The Road to embedded world North America: Explore ATTEND’s Rugged Sealed I/O and High-Speed Board-to-Board Connectors

By Chad Cox

Production Editor

Embedded Computing Design

October 14, 2025

Blog

The Road to embedded world North America: Explore ATTEND’s Rugged Sealed I/O and High-Speed Board-to-Board Connectors
Image Credit: ATTEND

Visitors to embedded world North America can stop by Booth 8080 where ATTEND Technology will be demonstrating its high-speed modular board to board interconnects, FAKRA and Mini-FAKRA connectors, as well as its rugged sealed I/O connectors and cables.

Highlights:

M.2, MXM and B2B Connectors

Its M.2 Gen5, MXM edge card connectors, and precision board-to-board interconnects support 5G, Wi-Fi, LTE, storage, GPU/AI acceleration modules, and PCB-to-PCB connections guaranteeing signal integrity and scalability.

FAKRA & Mini-FAKRA Connectors

ATTEND’s FAKRA and Mini-FAKRA connectors provide high-frequency performance for automotive and embedded communications. The Mini-FAKRA series supports frequencies up to 15 GHz while reducing footprint by up to 80% all while following ISO 20860-1/2, SAE/USCAR-2, and USCAR-17 standards.

Rugged Sealed I/O Connectors and Cables

Showcased will be the modular M12 Two-Piece Push-Pull and Metric Circular series, designed for harsh industrial environments. The interconnects feature IP-rated protection and vibration resistance delivering reliable connectivity for robotics, smart infrastructure, and edge equipment.

For more information, visit attend.com.tw/en.

To secure your FREE ticket to embedded world North America click here https://www.prereg.net/2025/ewna and use promo code: OPENSY25

Chad Cox is the Production Editor at Embedded Computing Design. His responsibilities are centered around content creation, writing and editing, and article research and development. Chad covers industry news and events and is known to interact with various industrial leaders via on-premise visits and online interviews. He is responsible for the digital footprint and dissemination of news via social media posts, advertising creation and the production of newsletters including the Embedded Computing Design’s Daily.

He is well versed in many facets of industrial computing including Edge AI, IoT, Processing, Security, Open Source, and more.

Chad graduated from the University of Cincinnati with a B.A. in Cultural and Analytical Literature and holds a master’s in education.

More from Chad