PICMG announced that COM-HPC has entered member review.

Per a company press release, the member review phase occurs after the technical subcommittee approves the specification and acts as a final review by all PICMG members in good standing. Reaching this approval step is a milestone in ensuring ratification will be reached in early 2021. The base specification will complement a Platform Management Interface Specification, COM-HPC EEEP, and Carrier Board Design Guide.

Further, COM-HPC is the soon-to-be released PICMG standard for high-performance COMs. It defines five different module sizes to deliver edge server performance. The specification blend with COM Express.

The specification was created to address requirements in the embedded and edge computing markets.

Technical Highlights per the release include:

• Two 400-pin BGA mount high-performance connectors
• System Management Interface
• Not limited to x86 processors
• Provides for the use of RISC processors, FPGAs and GPGPUs
• COM-HPC Client Modules
• Up to 48 + 1 PCI Express Gen4/5 lanes
• Up to 4x USB4
• Up to 4x video interfaces
• Up to 2x 25 Gb Ethernet interfaces
• Module sizes:
• Size A: 95 x 120 mm
• Size B: 120 x 120 mm
• Size C: 160 x 120 mm
• COM-HPC Server Modules
• Up to 64 + 1 PCI Express Gen4/5 lanes
• Up to 2x USB4
• Up to 4 graphic interfaces / headless
• Up to 8x 25 Gb Ethernet interfaces
• Module sizes:
• Size D: 160 x 160 mm
• Size E: 200 x 160 mm

For more information, visit https://www.picmg.org/com-hpc-overview/.