Whitepaper COM-HPC®: Taking Standardized COMs to the Next Level

The long-established COM Express® standard for Computer-on-Modules (COM) has recently been joined by COM-HPC®, a new High Performance Computing standard from the PCI Industrial Computer Manufacturers Group (PICMG®).

The embedded computing industry must always be ready to anticipate and respond quickly to the challenges of future technologies and applications. These are being driven by the industrial internet of things (IIoT), some of which are already starting to make an impact: Artificial Intelligence/Machine Learning/Deep Learning and the arrival of autonomous driving and 5G wireless will create enormous data volumes requiring unprecedented computing power and greater connectivity. Totally new design concepts for embedded computers are urgently required as existing standards will no longer be sufficient to cope. These must withstand harsh environments, offer cooling solutions suitable for the embedded industry, enable individual system solutions, and bring all the benefits and advantages of a COM standard to the market.

Download the whitepaper to learn more about what the motivation behind this new standard is and what it means for the widely adopted COM Express®.