TechVision at embedded world 2026
March 27, 2026
Video
Rich Nass interviews Paul Hong with TechVision at embedded world 2026.
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NXP Announces UCODE Nxm RAIN RFID IC for Manufacturing, Healthcare, and Aviation
July 16, 2026
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How One 3D Printer Manufacturer Used SMARC Computer-On-Modules to Unlock Industrial 3D Printing
July 15, 2026
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GaN Gains Ground with Embedded Use Cases
July 15, 2026
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Element Six and Orbray Accelerate Wafer-Scale Single Crystal Diamond for Volume Production
July 13, 2026
Security
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Using Safety Application Notes to Aid Safety Designs—Part 4: Via FS-Enabled Components
July 14, 2026
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President Trump Announces Executive Order 14412: Securing the Nation Against Advanced Cryptographic Attacks
July 01, 2026
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Navigating the Cyber Resilience Act with NXP Semiconductors and Axis Communications
June 11, 2026
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San Francisco Circuits Achieves CMMC Level 2 Certification, Strengthening Defense Supply Chain Security
June 03, 2026
Software & OS
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McObject’s eXtremeDB 9.0 Update Accelerates Embedded AI, Predictive Maintenance, and Computer Vision Workloads
July 13, 2026
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FossID Announces Workflows to Help Enterprises Operationalize SBOM Lifecycle Management Across Complex Software Supply Chains
July 13, 2026
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Efficient Computer Releases Free Efficient Labs Platform to Simplify Embedded Development
July 07, 2026
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Renesas Acquires Software Developer Pictorus for a Boost to Renesas 365
July 01, 2026
HPC/Datacenters
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Preserve Data Center Power with 3 nm PCIe 6.0 Switches
May 19, 2026
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Rambus PCIe 7.0 Switch IP Boosts Bandwidth and Scalability for AI and HPC Applications
May 06, 2026
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Embedded Executive: Dealing With the Massive Power Draw in Data Centers | Infineon
March 25, 2026
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PSM Integration for Enhanced Module Solutions in 48 V Data Centers
March 04, 2026