The COMeT10-3900 from WinSystems is a COM Express Type 10 mini module and a new addition to the company’s computer-on-module product line. The COMeT10-3900 is a low power industrial module featuring an Intel Atom E3900 series System on Chip (SoC) processor. The COMeT10-3900 supports Linux, Windows 10, and other x86-compatible real-time operating systems, software drivers are also available via the WINSYSTEMS website.

The small form factor module is designed for use in applications for autonomous vehicles, digital surveillance, transportation, Mil/COTS, industrial automation, and medical diagnostics.

The COMeT10-3900 mini module is designed as a processor mezzanine that is able to plug onto a carrier board equipped with user specific I/O requirements. The COM Express module also allows users to utilize the same carrier board design across scalable CPU series providing consistency and long-lasting use across multiple generations of COM Express modules. 

COM Express Type 10 Mini in Action

The module offers the user two options of display interfaces, one digital display interface that can be converted to DisplayPort, HDMI or DVI on the carrier, and one embedded DisplayPort (eDP) LCD interface that can be optionally occupied with a single-channel LVDS output. The eDP output is powered by the Intel HD Graphics 505 achieving 4k resolution output at 24 bits per pixel and a 60Hz refresh rate.

The module offers connectivity options with four PCIe lanes configurable as 4x1, 2x1 + 1x2, or 1x4, two USB 3.1 Gen 1 and six USB 2.0 channels, and one i210 1Gb/s Ethernet RGMII with IEEE 1588 support. HD audio signals and two SATA 3.0 channels are offered as well. Additional expansion options include 2x UART and 4x GPI, 4x GPO (SDIO option for MicroSD socket).

The module provides the system with memory at 8GB LPDDR4 2400 MT/s and hardware security with on-board discrete TPM 2.0.

Designed for operation in rugged and industrial IoT environments, the module operates at a temperature range of -40ºC to +85ºC. Wide-range power input achieves 4.75V to 20V DC, onboard eMMC 5.x storage options from 8GB to 128GB, and soldered LPDDR4 for shock and vibration.

Other components of the COMeT10-3900 COM Express mini module include a debugging interface connector. Another option includes USB debugging via USB 3.2, Gen 1 Port 0 for code development. The COMeT10-3900 also includes a four-lane MIPI Camera Serial Interface 2 (MIPI-CSI-2) D-PHY 1.2 camera input, equipped with trigger and sync GPIO signals, and I2C control lines.

Getting Started with the COMeT10-3900

When getting started with the COMeT10-3900 it is important to first make sure you are installing your module onto a compatible COM Express Type10 carrier board. For mounting options, the user must make sure the COMeT10-3900 standoffs are aligned with the with the mounting holes on the carrier board.

Next the user should ensure the COM Express Type 10 mini interface connector (J200) is placed in the COMe connector socket on the carrier board. Pressure must be applied to the red region highlighted on the graphic below.

The last step to getting started with the COMeT10-3900 is securing your module by inserting and tightening down all the screws the were included in the heat spreader/ heat sink for thermal management (sold separately).

Per the company, COMeT10-3900 modules will become available during the fourth quarter of 2020

References:

COMeT10-3900 COM Express Type 10 Mini module: https://www.winsystems.com/product/comet10-3900/

COMeT10-3900 COM Express Type 10 Mini module resources: https://resources.winsystems.com/product-manuals/COMeT10-3900-v1.0.pdf

COMeT10-3900 COM Express Type 10 Mini module data sheets: https://resources.winsystems.com/datasheets/comet10-3900-ds-1.2.pdf