Avalue Introduces ARC-39 Series Rugged Panel PCs for Smart Manufacturing, Retail, and Logistics
September 02, 2025
News
Avalue introduced its Intel Alder-Lake N/ Amston Lake/ Twin Lake powered ARC-39 series available in seven various sizes and highlighted IET (Intelligent Expansion Technology) modular expansion design offering flexibility and customization.
The seven models include the ARC-1039, ARC-10W39, ARC-1239, ARC-1539, ARC-15W39, ARC-18W39, and ARC-21W39 ranging in size from 10.1” to 21.5”. According to Avalue, all models are integrated with Intel N97/ X7433RE /N150 processors with optional enhancements to higher-end Intel Core 3 Processor N305/ N355 with support up to 16GB of DDR5 SO-DIMM memory.
Rugged features consist of shock (20G) and vibration (2Grms) resistance that complies with MIL-STD-810G standards as well as a IP65 rated front panel for water and dust resistance, while the rear panel is rated IP41. Customers have a choice between Full Flat PCAP multi-touch or 5-wire resistive touch panels. The resistive touch models also support a wide operating temperature range of -20°C to 60°C.
By employing swappable IET modules, users can quickly expand I/O interfaces as required, including the addition of USB, HDMI, CAN Bus, RS-232, or other customized functions.
Ideal Edge Applications:
Smart Manufacturing & Industrial Automation:
- Designed to use as an HMI (Human-Machine Interface) or production line control panel
- IET module allows flexible I/O expansion to connect various sensors and control devices for real-time production monitoring and data acquisition
Smart Retail & Transportation:
- Serves as a self-service kiosk, digital signage, or in-vehicle infotainment system
- IET module can be equipped with 5G or LTE modules for high-speed wireless connectivity
Logistics & Warehouse Management:
- Deployed as a forklift operation terminal, control panel for automated guided vehicles (AGVs), or HMI for warehouse management systems
For more information, visit avalue.com/en.
Chad Cox is the Production Editor at Embedded Computing Design. His responsibilities are centered around content creation, writing and editing, and article research and development. Chad covers industry news and events and is known to interact with various industrial leaders via on-premise visits and online interviews. He is responsible for the digital footprint and dissemination of news via social media posts, advertising creation and the production of newsletters including the Embedded Computing Design’s Daily.
He is well versed in many facets of industrial computing including Edge AI, IoT, Processing, Security, Open Source, and more.
Chad graduated from the University of Cincinnati with a B.A. in Cultural and Analytical Literature and holds a master’s in education.
