Ironwood Electronics 22×22 Array BGA Package Targets High-Reliability Automotive PCBs
January 12, 2026
News
Ironwood Electronics released a 19x19mm body, 22X22 array 484 ball BGA package that can be SMT affixed to a top adapter or placed inside a compression mount socket fitted to the top adapter. As for the bottom adapter, it is attached to the target PCB using reflow. Both top and bottom adapters can be plugged and un-plugged several times and operate without conceding performance in rugged automotive applications.
For more information, visit ironwoodelectronics.com/press/chip-size-0-8mm-pitch-bga-socket-adapter/.
Chad Cox is the Production Editor at Embedded Computing Design. His responsibilities are centered around content creation, writing and editing, and article research and development. Chad covers industry news and events and is known to interact with various industrial leaders via on-premise visits and online interviews. He is responsible for the digital footprint and dissemination of news via social media posts, advertising creation and the production of newsletters including the Embedded Computing Design’s Daily.
He is well versed in many facets of industrial computing including Edge AI, IoT, Processing, Security, Open Source, and more.
Chad graduated from the University of Cincinnati with a B.A. in Cultural and Analytical Literature and holds a master’s in education.
