The passively cooled conga-B7AC modules are deployment-ready for redundant, virtualized, and real-time communications applications that require high uptime and low latency. A cloud API provides remote monitoring capabilities for data center operators, while a Network Controller Sideband Interface (NC-SI) is provided to connect to a baseboard management controller (BMC) that enables out-of-band remote manageability.

All modules provide up to 48 GB of 2400 MHz DDR4 memory with or without error correcting code (ECC).

“Distributed embedded edge devices supporting 10 GbE bandwidth can be utilized as small cells for next generation LTE networks, device nodes for cyber-virtual factories, or local micro data centers for sensor networks. For these tasks, they need to handle massive TCP/IP communication and storage bandwidths in real-time,” says Martin Danzer, Director of Product Management at congatec. “This is the application area where the new server-grade Intel Atom C3000 processors are a perfect addition to our Intel Xeon D processor based Server-on-Module portfolio. Thanks to their reduced cost and power consumption, we are now able to bring massive network bandwidth and storage capabilities deeply into the industrial field.”

Additional I/O on the conga-B7AC modules includes 2x SATA 6G ports, 6x USB (2x USB 3.0, 4x USB 2.0), 2x UART, LPC, SPI, and I2C. The module also hosts a trusted platform module (TPM) for applications with high security requirements.

congatec offers conga-B7AC board support packages (BSPs) for all 64-bit Microsoft Windows operating systems, as well as Red Hat Enterprise Linux Server.

The PICMG COM Express 3.0-compliant modules are available now off-the-shelf. More information can be found at www.congatec.com/en/products/com-express-type-7.

eletter-09-13-2017