Chenbro Announces Chassis Reference Motherboard Program for Intel Ice Lake Processor Platform with Ma Labs

Chenbro

Ma Labs

May 4, 2021

Taipei, Taiwan — Chenbro (TWSE: 8210) announced its reference motherboard program, launching in collaboration with Ma Labs (USA), which will provide pre-tested 3 rd Generation Intel Xeon Scalable (codename ‘Ice Lake’) server barebone solutions for the North American market.

Logic Design Solutions Introduces the First NVMe HOST IP on POLARFIRE SoC FPGA

Tiera Oliver

May 4, 2021

The GENE-CML5 3.5" Subcompact Board From AAEON Offers Functionality to Support Industrial and AI Applications

Tiera Oliver

April 27, 2021

IoT Security and the Protection of IP at the Edge

Jake Schaffner

April 26, 2021

DEV KIT WEEKLY: Maxim Integrated Health Sensor Platform 3.0 Kit

Brandon Lewis

April 23, 2021

This isn’t the first Maxim Integrated development kit we’ve reviewed on Dev Kit Weekly, nor the first one that focuses on the healthcare sector. Back in 2019, we took a look at the company’s MAX86150EVSYS kit that targets mobile heart rate monitoring using ECG and PPG sensors. The Health Sensor Platform 3.0 takes that concept into a wearable form factor that integrates those same sensors, as well as a skin temperature sensor, that make it an ideal starting point for those of you developing personal fitness devices, patient health monitors, and so on.

aicas GmbH, SiFive Collaborate to Integrate RISC-V CPU architecture, JamaicaVM Java-Based Software Management

Perry Cohen

April 19, 2021

Renesas Strengthens RL78 Family of Low-Power MCUs with 16-Bit General-Purpose RL78/G23

Tiera Oliver

April 19, 2021

TQMLX2160A: the highspeed giant by TQ

TQ-Group

NXP Semiconductors

April 19, 2021

Embedded Cortex®-A72 module based on LX2160A with enhanced data and networking performance.

Industry High 98% Efficiency Demonstrated by AImotive and Nextchip

Tiera Oliver

April 19, 2021

Edge Management: The Next Big IoT Challenge

James White

April 19, 2021

Techniques to Improve UX for Success in Embedded Markets

Jason Clarke

April 16, 2021

STMicro Using OctaBus Flash Memory from Macronix

Perry Cohen

April 15, 2021

Embedded Systems: The Big Picture

Ian Ferguson

April 14, 2021

Accelerate AI Applications Using VITIS AI on Xilinx ZynqMP UltraScale+ FPGA

Vaibhav Kothari

April 13, 2021

Automotive-Grade MEMS Mics Raise the Standard for In-Cabin Audio

Rich Nass

April 12, 2021

Starting into the World of Small-Run PCBAs

Jeremy S. Cook

April 12, 2021

Perform AI at the Edge with NGC-ready Hardware

Lanner Electronics

NVIDIA

April 9, 2021

A key technology behind AI at the Edge is the GPU. Harnessing the complexity of the GPU for applications like inferencing is not something that’s easily digestible for the novice engineer. That’s where folks like Lanner come into play. With the company’s Edge AI Appliance LEC-2290 system, engineers can focus on the specific application without having to deal with the underlying hardware.

Litemax Announces the AMIX-CML0 Mini-ITX Embedded Board Featuring 10th Gen. Intel Core

Tiera Oliver

April 6, 2021

Infineon Expands Wireless Portfolio with the AIROC Wi-Fi 6/6E-certified Solutions

Perry Cohen

April 6, 2021

Lattice Brings Embedded Vision Optimized FPGA to Automotive Applications

Tiera Oliver

April 5, 2021

Neousys Technology Releases the Nuvo-8108GC-XL Edge AI GPU Computing Platform

Perry Cohen

March 29, 2021

Sondrel Invests Heavily in Own R&D Program

Sondrel

March 29, 2021

Simple Integration, Short Time to Market, and High ROI Are the Hallmarks of the CLEA AI IoT Offering

SECO

March 18, 2021

We spend a lot of time discussing the various hardware elements of an AI system. Should it be a CPU or a GPU or a combination? What about the new entrant, the TPU? Then there’s the memory subsystem and the bus architecture. Not to mention the different sensors that are needed for the specific application.

Servotronix Partners with STXI Motion to Release softMC Compact Microcontroller

Perry Cohen

March 12, 2021