congatec’s new Computer-on-Module is for the entry-level of high-end embedded computing based on Intel’s latest Core i3-8100H processor platform. Its fast 16 PCIe Gen 3.0 lanes make it conducive for new artificial intelligence (AI) and machine learning applications requiring multiple GPUs for massive parallel processing.

The new conga-TS370 COM Express Basic Type 6 Computer-on-Module with quad-core Intel Core i3 8100H processor offers:

• 45 watt TDP configurable to 35 W, supports 6 MB cache and provides up to 32 GB dual-channel DDR4 2400 memory, helping increase the graphics and GPGPU function of the integrated new Intel UHD630 graphics.
• Supports up to three independent 4K displays with up to 60 Hz via DP 1.4, HDMI, eDP and LVDS, allowing designers to switch from eDP to LVDS by altering the software without any hardware changes.
• It provides high bandwidth I/Os including 4x USB 3.1 Gen 2 (10 Gbit/s), 8x USB 2.0 and 1x PEG and 8 PCIe Gen 3.0 lanes for powerful system extensions including Intel Optane memory.
• It supplies an impressive gamut of accessories and technical services, simplifying the integration of new modules into customer-specific solutions.

The new module is now available worldwide in the following standard configuration:

"The 3 GHz quad-core Intel Core i3 processor and the new HM370 Platform Controller Hub offer a particularly high performance per watt ratio as well as an unbeaten performance per dollar ratio," said Martin Danzer, congatec’s Director of Product Management. “The price has fallen significantly – so customers can now serve even the most computational intensive AI applications at an affordable price level.”

For more information, visit www.congatec.com.