The Barr Group at Embedded World 2018 - Embedded Computing Design

February 27, 2018

Video

Rich Nass, EVP of Editorial, interviews Michael Barr from the The Barr Group in the shared Embedded Pavillion, booth 3A-507. #ew18 #iot @embedded_world

eletter-03-01-2018

AI & Machine Learning

NI Connect 2026: The New Era of Test

May 15, 2026

Arduino: Portenta H7
May 12, 2026
STMicroelectronics: STM32U3B5
May 12, 2026
Arm: Cortex-M0+
May 12, 2026
Semidynamics and SiPearl Partner on European Rack-Scale AI Compute Platform
May 12, 2026

MORE

Storage

How Synthetic DNA for Data Storage Could Help the Memory Crisis

May 1, 2026

Rambus SOCAMM2 Delivers Low-Power LPDDR5X Memory Performance for AI Server Infrastructure
April 23, 2026
Embedded Executive: We Are In a Memory Crisis | Everspin
April 01, 2026
embedded world 2026 Podcast with Rambus
March 27, 2026
Accelerate AI Workloads with Rambus HBM4E Memory Controller
March 05, 2026

MORE

HPC/Datacenters

Image Credit: Rambus

Rambus PCIe 7.0 Switch IP Boosts Bandwidth and Scalability for AI and HPC Applications

May 6, 2026

Embedded Executive: Dealing With the Massive Power Draw in Data Centers | Infineon
March 25, 2026
PSM Integration for Enhanced Module Solutions in 48 V Data Centers
March 04, 2026
BCM Teams Up with Intel for 2U Rackmount Edge AI Workstation
March 04, 2026
Menlo Micro and Purdue University Announces Commercial-Ready Architecture for Scalable Quantum Computing at Cryogenic Temperatures
March 03, 2026

MORE

Edge AI

Image Credit: ScioSense

ScioSense Launches UFC23 Ultrasonic Flow Converter for Smart Water, Heat, and Gas Meters

May 15, 2026

Darveen to Showcase Edge AI and Rugged Industrial Systems at COMPUTEX 2026 and Automate 2026
May 15, 2026
Qualcomm: IQ-9075 Evaluation Kit (EVK)
May 12, 2026
Altera: Agilex™️ 5 FPGA and SoC FPGA D-Series
May 12, 2026
NXP: i.MX RT1010
May 12, 2026

MORE