Adesto Lowers Power In Its Latest Flash Memory Devices

By Rich Nass

Contributing Editor

Embedded Computing Design

March 05, 2019

News

Adesto Lowers Power In Its Latest Flash Memory Devices

Adesto's FusionHD non-volatile memories (NVMs) are aimed at consumer and industrial IoT Edge devices.

I’m often impressed with the memory vendors, as it seems like they continue to innovate in a space that always seems like it’s out of room for innovations, except on the manufacturing side. Adesto Technologies was the latest memory vendor to hit my radar, this time at the recent Embedded World show in Nuremberg, Germany.

Adesto’s FusionHD non-volatile memories (NVMs) are aimed at consumer and industrial IoT Edge devices. It delivers low power consumption, fast data transfer and robust, high-reliability operation. Unlike standard flash devices, FusionHD incorporates a small-page erase and write architecture that makes saving small packets of data quick and efficient. It also allows large data packets to be saved and accessed using minimal CPU clock cycles, reducing processing time and battery consumption.

The latest parts offer 32 Mbits of storage and operating voltage levels of 1.7 to 3.6 V. Another interesting feature is the ability to interrupt the host MCU when needed. Samples of FusionHD AT25XE321B are available now.

FusionHD supports the new Serial Flash Reset Signaling Protocol (JESD252) and the latest version of the SFDP standard (JESD216D). These standards make it easier for system designers to deliver smarter, more efficient and user-friendly devices.

Rich Nass is a regular contributor to Embedded Computing Design. He has appeared on more than 500 episodes of the popular Embedded Executive podcast series, and is a regular contributor to the Embedded Insiders podcast.

Rich has been in the engineering OEM industry for more than 35 years, and is a recognized expert in the areas of embedded computing, Edge AI, industrial computing, the IoT, and cyber-resiliency and safety and security issues. He writes and speaks regularly on these topics and more.

Rich is currently the Liaison to Industry for the Embedded World North America Exhibition and Conference, and has held similar positions with the global Embedded World Conference and Exhibition.

Previously, Rich was the Brand Director for UBM’s award-winning Design News property. Prior to that, he led the content team for UBM Canon’s Medical Devices Group, as well all custom properties and events.  In prior stints, he led the Content Team at EE Times, handling the Embedded and Custom groups and the TechOnline DesignLine network of design engineering web sites.

Nass holds a BSEE degree from the New Jersey Institute of Technology.

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