TDK Announces MIPI Standard SoundWire Microphone
January 23, 2020
News
TDK Corporation introduces the MIPI Standard SoundWire microphone for mobile, IoT and other consumer devices.
TDK Corporation introduces the MIPI Standard SoundWire microphone for mobile, IoT and other consumer devices. This multimode microphone provides advanced feature sets with very low power.
The T5808 SoundWire microphone features 66 dBA SNR and 135dB SPL AOP at 650 µA in high quality mode (HQM), and decreases power consumption to 215µA in low power mode (LPM). The T5808 microphone also features concurrent mode (CCM), enabling simultaneous audio streams from HQM and LPM that can transition back and forth without audio glitches.
SoundWire is a standard audio bus that supports multiple audio devices including microphones, speakers, codecs and class D amplifiers. SoundWire integrates audio and control data for up to 11 devices (e.g. 7mics, 4 speakers) on a single bus.
T5808 is currently in mass production and will be available through distribution in Q1 2020. For samples and additional information, please contact [email protected] or visit www.invensense.tdk.com/products/digital/t5808/
Glossary
- HQM: High Quality Mode
- LPM: Low Power Mode
- CCM: Concurrent Mode
- AOP: Acoustic Overload Point
Main applications
- Smartphones
- Microphone Arrays
- Tablets
- Cameras
- Bluetooth Headsets
- Notebook PCs
- Security and Surveillance
Key features
- 5 × 2.65 × 0.98 mm surface?mount package
- Low power: 215 µA in Low?Power Mode
- Extended frequency response from 40 Hz to >20 kHz
- Sleep Mode: 10 µA
- High power supply rejection (PSR): −91 dB FS
- Fourth?order Σ?Δ modulator
- Digital pulse density modulation (PDM) output
- Compatible with Sn/Pb and Pb?free solder processes
- RoHS/WEEE compliant
Key data
|
Product |
T5808 |
|
Packaging Dimensions (mm) |
3.50 × 2.65 × 0.98 |
|
SNR dBA |
66 |
|
Acoutsic Overload Point dB SPL |
135 |
|
Low Power Mode µA |
215 |
|
Bandwidth kHz |
20 |
|
Low Frequency Corner Hz |
40 |
|
Digital Interface |
SoundWire |
Tiera Oliver is the assistant managing editor at Embedded Computing Design. She is responsible for web content editing, product news, and story development. She also manages, edits, and develops content for ECD podcasts, including Embedded Insiders.
She utilizes her expertise in journalism and content management to oversee editorial content, coordinate with editors, and ensure high-quality output across web, print, and multimedia platforms. She manages diverse projects, assists in the production of digital magazines, and hosts company podcasts by conducting in-depth interviews with industry leaders to deliver engaging and insightful discussions.
Tiera attended Northern Arizona University, where she received her bachelor's in journalism and political science. She was also a news reporter for the student-led newspaper, The Lumberjack.
