Murata Introduces the 48 Vin Charge Pump Step-Down, DC-DC Converter Module
June 08, 2022
News
Murata announced the development of the MYC0409, the industry’s highest power density (5.4kW/inch3), 48 Vin divide-by-4 charge pump capacitor divider module with all passive components integrated in a low profile PSiP package.
Capable of delivering up to 72 watts of power with peak efficiency of around 97-percent, the interleaved, switching capacitor architecture is based on Murata’s unique lossless charge pump technology, providing low input and output ripple performance. The solution is presented in a compact footprint with 2.0 mm height, making it ideal for low profile applications and placement on the underside of system boards.
MYC0409 devices can be connected in parallel to provide high power, high efficiency solutions suitable for a variety of 48V to 12V step-down conversion applications such as datacenters, networking routers, base stations and optical equipment.
Companies have traditionally relied upon brick converters to stepdown from 48V to the intermediate bus, usually 12V. The MYC0409 breaks the mold by enabling system architects to design high density, 48V converters in a smaller footprint with enhanced efficiency and low ripple performance. System designers have the flexibility to choose between creating a single high-power bulk 48V bus system with MYC0409 devices connected in parallel or distributing individual MYC0409 devices close to the point-of-load, thereby reducing system PCB copper losses.
The MYC0409 is designed to operate in a fixed divide-by-4 mode over an input voltage range of 20V to 60V, which extends its usage to 24V to 36V input applications typically used in consumer battery charging and industrial supplies. The charge pump-based DC-DC converter supports an output voltage range of 5V to 15V with load currents of 6A and up to 72W delivered to the external load. Featuring an extended temperature range of -40 to +105℃, the MYC0409 is fully protected with input undervoltage, overcurrent protection, and thermal shutdown fault detection.
*Specifications and appearance are subject to change without notice.
The MYC0409 is 11.5 x 9.5 x 2.0 mm and offered in Land-Grid-Array packaging (LGA).
For more information, visit: www.murata.com.
Tiera Oliver is the assistant managing editor at Embedded Computing Design. She is responsible for web content editing, product news, and story development. She also manages, edits, and develops content for ECD podcasts, including Embedded Insiders.
She utilizes her expertise in journalism and content management to oversee editorial content, coordinate with editors, and ensure high-quality output across web, print, and multimedia platforms. She manages diverse projects, assists in the production of digital magazines, and hosts company podcasts by conducting in-depth interviews with industry leaders to deliver engaging and insightful discussions.
Tiera attended Northern Arizona University, where she received her bachelor's in journalism and political science. She was also a news reporter for the student-led newspaper, The Lumberjack.
