Infineon Expands Supplier Base for Silicon Carbide Wafers, Supply Agreement Signed with US-Based II-VI Incorporated
August 26, 2022
News
Infineon Technologies AG and II-VI Incorporated have signed a multi-year supply agreement for silicon carbide (SiC) wafers. The German-based semiconductor manufacturer is securing further access to this strategic semiconductor material to meet the increase in customer demand in this area.
The agreement also supports Infineon's multi-sourcing strategy and increases its supply chain resilience. The first deliveries have already taken place.
SiC is a compound of silicon and carbon that enables efficient and robust power semiconductors with a cost-benefit at the system level. The CoolSiC™ brand from Infineon part of the industry's portfolio for industrial power semiconductor applications. In addition to photovoltaic converters and industrial power supplies, the advantages of SiC are also evident in the field of e-mobility. SiC power semiconductors are used in the main inverters for e-vehicle drive trains, in onboard battery charging units, and in charging infrastructures. The material meets quality standards for industrial and automotive applications. As strategic partners, II-VI and Infineon are also collaborating in the transition to 200mm SiC diameter wafers.
“SiC compound semiconductors set new standards in power density and efficiency. We are leveraging them to deliver on our strategy of decarbonization and digitalization,” said Angelique van der Burg, Chief Procurement Officer at Infineon. “Infineon is increasing investments in its SiC manufacturing capacity to meet the rapidly growing demand from our customers. We are pleased to add II-VI to our strategic supplier base and grow our business together.”
Infineon expects its SiC semiconductor sales to grow by more than 60 percent on average per year, reaching approximately $1 billion by mid-decade. For the second half of the decade, Infineon expects on-going growth momentum, for which it invests in its recently announced additional manufacturing block in Kulim, Malaysia.
For more information, visit: www.infineon.com
Tiera Oliver is the assistant managing editor at Embedded Computing Design. She is responsible for web content editing, product news, and story development. She also manages, edits, and develops content for ECD podcasts, including Embedded Insiders.
She utilizes her expertise in journalism and content management to oversee editorial content, coordinate with editors, and ensure high-quality output across web, print, and multimedia platforms. She manages diverse projects, assists in the production of digital magazines, and hosts company podcasts by conducting in-depth interviews with industry leaders to deliver engaging and insightful discussions.
Tiera attended Northern Arizona University, where she received her bachelor's in journalism and political science. She was also a news reporter for the student-led newspaper, The Lumberjack.
