Embedded Computing Design

Industry News - Page 191

Networking & 5G
STMicroelectronics Announces GUI Design for Low-Cost Devices with TouchGFX Updates and New STM32 Nucleo Shield

Tiera Oliver

October 12, 2020

Networking & 5G
Texas Instruments Introduce DP83TD510E, Ethernet Physical Layer

Perry Cohen

October 9, 2020

Industrial
PICMG Ratifies MicroSAM, Microcontroller-Agnostic Module Form Factor for the Enablement of Smart Sensors

Tiera Oliver

October 8, 2020

Processing
Efinix Announces Availability of Reconfigurable Acceleration Platform (RAP) Initiative

Perry Cohen

October 8, 2020

Processing
Avnet Releases New RFSoC Development Kit for mmWave

Perry Cohen

October 8, 2020

Processing
STMicroelectronics Introduces Bluetooth 5.2-Certified SoC

Tiera Oliver

October 8, 2020

Industrial
ON Semiconductor Introduces CMOS Global Shutter Image Sensor for Machine Vision and Mixed Reality Applications

Tiera Oliver

October 8, 2020

Industrial
Rockwell Automation, Microsoft Announce 5-Year Partnership Expansion

Perry Cohen

October 7, 2020

IoT
Veea Joins Microsoft Azure Certified for IoT

Perry Cohen

October 7, 2020

Industrial
Claroty Releases New Cybersecurity Research Showing Increased Threat During the Pandemic

Perry Cohen

October 7, 2020

Storage
Alliance Memory Expands Lineup of High-Speed CMOS DDR4 SDRAMs With New 8Gb Devices

Tiera Oliver

October 6, 2020

AS4C1G8D4 and AS4C512M16D4 High-Speed CMOS DDR4 SDRAMs
Storage
Renesas I3C Bus Extension and SPD Hub Devices Qualified for ASPEED AST2600 Baseboard Management Controller

Tiera Oliver

October 5, 2020

Processing
TQ Introduces New Intel Atom x6000E Based Computer-on-Module Product Family

Tiera Oliver

October 5, 2020

Storage
Swissbit Expands Miniaturized Storage Solutions with EM-30

Perry Cohen

October 5, 2020

Swissbit announced its has expanded its portfolio of miniaturized storage solutions with the EM-30 device, featuring an e.MMX-5.1 standard interface.
Analog & Power
Vishay Intertechnology Extends EP1 High Energy Wet Tantalum Capacitor With New Ratings in the B and C Case Codes

Tiera Oliver

October 5, 2020

Built on Vishay's SuperTan technology, the EP1 now features high capacitance from 3,600 µF to 40,000 µF in the B case code and 5,300 µF to 58,000 µF in the C case code
AI & Machine Learning
Image Credit: STMicroelectronics
Empowering Your Creativity: The STM32 Summit

November 20, 2024

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Automotive
Renesas Announces Automotive Multi-Domain SoC Built with 3-nm Process Technology

November 25, 2024

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Processing
Image Credit: Ambiq
Ambiq’s Apollo4 Plus SoC Leverages Edge Impulse for Scalable Edge AI Solutions

November 21, 2024

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Software & OS
Memory Safety in Ada, SPARK, and Rust

November 22, 2024

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