Sondrel introduced an advanced modelling process for AI chip development with functional verification that runs through every phase of a chip’s development to verify the design is what was defined, and performance verification guaranteeing the chip works as desired. Paul Martin, Sondrel’s Global Field Engineering Director, comments “This new process enables us to analyze and balance the dataflow through the chip whilst executing the software workloads on the AI chip.”

 

Sondrel (LON: SND), a leading provider of ultra-complex chips for leading global technology brands, has announced that it has completed its most complex chip design to date. Designed on a 5nm process node, this ultra-complex design has more than 50 billion transistors.

 

Reading, United Kingdom. Sondrel will be continuing to leverage Siemens EDA software with a new three-year contract. The partnership will keep Sondrel leading the global semiconductor market with customer specific ultra-complex ASIC chip solutions concerning EDA software applications.

Reading, UK. Sondrel released its Architecting the Future family covering the SFA 100 to the SFA 350A.

Leading edge digital ASIC design becomes more complex every year needing teams of dozens of people working on all the different aspects of it. According to Sondrel, who specialises in these advanced chip designs, there is a growing need for Systems Architects who coordinate every aspect of a design project, hence the company is actively recruiting for specialists with the skill sets that can do this.

Sondrel's new SFA 100 IP reference platform makes creating high-performance battery powered IoT devices fast and easy.

Sondrel launched its new, quad-channel, IP reference platform that has been architected with ISO26262 applications and the integration of customer IP in mind.