COMh-caAP and COMe-cAP6: Kontron Advances industrial High-Performance Computing

Tiera Oliver

July 1, 2022

congatec Releases 5 COM-HPC Server Size D Modules Powered by Intel

Chad Cox

June 28, 2022

7 New High Power and Passively Cooled CoMs from congatec

Chad Cox

June 28, 2022

Platforms for Functionally Safe Computing, Considering Mixed-Critical Applications

Chad Cox

June 28, 2022

Driving the No-Code Robot Revolution

Jeff Shepard

June 27, 2022

How to Make Your Heat Pump Designs More Reliable, Safer, and with Higher Efficiency

Ryan Sheahen

June 27, 2022

Solid Sands and SYSGO Expand Their Collaboration to Assist Customers with Safety-Critical Projects

Chad Cox

June 27, 2022

Deploying AI Vision Kits for Advanced Image Processing and Analytics

Saumitra Jagdale

June 24, 2022

Virtium Introduces High-Endurance M.2 PCIe/NVMe Industrial SSDs

Tiera Oliver

June 24, 2022

A New Generation of Enhanced Projected Capacitive Touch Solutions from Review Display System

Tiera Oliver

June 24, 2022

Building Faster, Safer Responsive Robots for the Edge

Wind River

June 23, 2022

Renesas Creates Circuit Technologies for 22-nm Embedded STT-MRAM with Faster Read and Write Performance for IoT MCUs

Chad Cox

June 23, 2022

Avery Design Systems Announces Verification Support for New UCIe Standard, Speeding Up Chiplet Interconnect Protocol Adoption

Chad Cox

June 23, 2022

Murata Releases First Automotive Grade Three-Terminal 0402 MLCC Delivering 4.3 µF Capacitance

Chad Cox

June 23, 2022

Make Any Sensor a Smart Sensor with PICMG IoT.1, Part 5: Integrating Effecters 

Brandon Lewis

June 22, 2022

Semtech Announces the Integration of LoRaWAN into Cranberry Analytics' Smart Water Metering Solution.

Chad Cox

June 22, 2022

The CommAgility High-Performance 5G Small Cell Reference Platform is Now Available.

Chad Cox

June 22, 2022

StradVision Attending CVPR 2022 in New Orleans

StradVision

June 22, 2022

Wirepas Mesh 2.4 GHz Wireless Modules are now available from Fujitsu

Chad Cox

June 22, 2022

Embedded Executive: Daniel Cooley, CTO, Silicon Labs

Rich Nass

June 22, 2022

Here at Embedded Computing Design, we spend a lot of time helping engineers/developers work through the pains of industrial designs.

SmartCow Edge AINVR Makes Its Debut on the NVIDIA Jetson NX-based Platform for Smart City Initiatives

Chad Cox

June 20, 2022

UTAC Releases a New High Output Copper Clip DFN for Discrete MOSFETs in Ultra High Density (UHD) Leadframes.

Chad Cox

June 20, 2022

Diodes Incorporated's PowerDI8080-Packaged MOSFET Increases Power Density in Modern Automotive Applications

Chad Cox

June 20, 2022