congatec Presents New Cooling Solutions for 100 Watt Edge Server Ecosystem
March 05, 2020
News
congatec presents three cooling solutions for the new 100 Watt edge server ecosystem that is being built around AMD EPYC Embedded 3000 Series Processors.
congatec presents three cooling solutions for the new 100 Watt edge server ecosystem that is being built around AMD EPYC Embedded 3000 Series Processors. With rugged cooling solutions and processor modules for 24/7 operation from a single source, OEMs no longer need to think about how to design in a processor waste heat management system.
According to the company, ideally matched cooling solutions aid the 100 Watt edge server ecosystem, as overheating can lead to rapid aging and system failure. Edge servers with real-time requirements need protection against thermally induced performance degradation to ensure deterministic behavior.
The congatec cooling solutions for the 100 watt ecosystem around the AMD EPYC Embedded 3000 Series Processors come in three variants, all based on the COM Express heat spreader specification that has been standardized by the PICMG: heat spreader with heat pipe adapter, heat spreader with integrated heat pipe, and an active cooling solution. Together with standard COM Express heat spreaders, OEMs can choose between four variants that cover the entire range of processor cooling solutions.
Heat pipe adapter for COM Express heat spreader
The conga-B7E3/HPA heat pipe adapter absorbs the waste heat from the heat spreader via up to four heat pipes and directs it, for example, towards other passive heat sinks mounted on the housing. This allows the design cooled systems for up to 100 Watt.
COM Express heat spreader with integrated heat pipe
The solution with integrated heat pipe, with the product name conga-B7E3/HSP-HP, was developed for flat embedded systems where a standard height COM Express heat spreader must be coupled to the housing. Here, the integrated heat pipe distributes the waste heat from the processor evenly over the entire heat spreader so that no hotspots are created, even in applications with a TDP of up to 100 Watt.
Active cooling system for rugged 24/7 operation
The fan-based active cooling system conga-B7E3/CSA-HP is designed for operation in harsh industrial environments. In this complete cooling system for COM Express Computer-on-Modules the fans are mounted extra securely but also fixed to reduce wear and tear. The bearings are equipped with a special seal and additional cover to provide maximum protection for mechanics and lubricant. With a high-performance synthetic oil as lubricant, the fan has an MTBF of several decades, and this in the industrial temperature range from -45 to +85 degrees C and with industrial-grade shock and vibration resistance. The functional scope of this fan-based active cooling system is rounded off by the additional integration of a heat pipe to distribute the waste heat from the processor before it reaches the active fan.
For more information, visit: https://www.congatec.com/en/technologies/com-express/com-express-type-7/amd-epyc-embedded-3000-eco-system.html
Tiera Oliver is the assistant managing editor at Embedded Computing Design. She is responsible for web content editing, product news, and story development. She also manages, edits, and develops content for ECD podcasts, including Embedded Insiders.
She utilizes her expertise in journalism and content management to oversee editorial content, coordinate with editors, and ensure high-quality output across web, print, and multimedia platforms. She manages diverse projects, assists in the production of digital magazines, and hosts company podcasts by conducting in-depth interviews with industry leaders to deliver engaging and insightful discussions.
Tiera attended Northern Arizona University, where she received her bachelor's in journalism and political science. She was also a news reporter for the student-led newspaper, The Lumberjack.
