Technology
Automotive
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AutoSens and InCabin will return to Huntington Place, Detroit | 9-11th June 2026
May 11, 2026
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embedded world 2026 Podcast with NXP
May 06, 2026
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New Eagle Releases OpenECU NX3 to Simplify EV Architectures with Unified Charging and Control
May 05, 2026
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POLYN Technology Announces Tapeout of Automotive Chip
April 29, 2026
Security
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embedded world 2026 Podcast with PQ Shield
May 04, 2026
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Using Safety Application Notes to Aid Safety Designs Part 2: Plugging in the FMEDA
April 28, 2026
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Digi DAL OS Solutions Gain FIPS 140-3 Validation for Government and Regulated Industries
April 16, 2026
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Microchip Secures IEC 62443-4-1 ML2 Certification, Strengthening Industrial Cybersecurity
April 10, 2026
HPC/Datacenters
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Embedded Executive: Dealing With the Massive Power Draw in Data Centers | Infineon
March 25, 2026
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PSM Integration for Enhanced Module Solutions in 48 V Data Centers
March 04, 2026
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BCM Teams Up with Intel for 2U Rackmount Edge AI Workstation
March 04, 2026
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Menlo Micro and Purdue University Announces Commercial-Ready Architecture for Scalable Quantum Computing at Cryogenic Temperatures
March 03, 2026
Edge AI
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Darveen to Showcase Edge AI and Rugged Industrial Systems at COMPUTEX 2026 and Automate 2026
May 15, 2026
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Qualcomm: IQ-9075 Evaluation Kit (EVK)
May 12, 2026
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Altera: Agilex™️ 5 FPGA and SoC FPGA D-Series
May 12, 2026
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NXP: i.MX RT1010
May 12, 2026